Product Performance Table

• Product nameS01XBIG58-HF1200B

• CompositionSn 0.1Ag Cu Bi Ni

• Melting Point（℃）211-227

• Particle Size（μm）20-38

• Flux Content（%）11.7

• Viscosity（Pa.s）190

• Halide content（%）0

• Flux TypeROL0（IPC J-STD-004D）

S01XBIG Alloy and SAC305: Difference is “Low-cost” and “High reliability”

In conventional low-Ag solder alloys, reducing Ag content often results in compromised joint reliability.
However, The S01XBIG58-HF1200B overcomes this trade-off. Through the optimized addition of Bi and Ni—each providing distinct metallurgical benefits—The S01XBIG58-HF1200B achieves joint strength comparable to SAC305 while maintaining excellent reliability.

At the same time, its lower Ag content helps manufacturers minimize solder paste cost fluctuations driven by rising Ag prices, enabling a more stable and cost-efficient production strategy.

2 Approaches to Achieve Superior Durability

Precipitation Strengthening: Nickel (Ni)
Fine intermetallic compounds with high melting points precipitate within the Sn crystal lattice to prevent dislocations from propagating beyond the grain boundaries.

Solid Solution Strengthening: Bismuth (Bi)
Atomic level strengthening by scattering of elements which have significantly larger atomic diameter in the Sn phase to generate strains in the crystalline lattice to prevent dislocation propagation.

Outperforms SAC305 in Thermal Cycle Resistance and Joint Strength

The strengthening elements suppress microstructural changes in the solder joint and intermetallic compound (IMC) growth during thermal cycling. Compared to SAC305, The S01XBIG58-HF1200B exhibits less strength degradation after thermal cycling and maintains high solder joint reliability.

■ Shear strength and thermal cycle testing（-30/+80℃）